Analytics
siliconanalysts.com
Provides semiconductor and AI hardware market data including accelerator costs, chip costs, HBM market information, supply-chain headlines, and wafer pricing.
ENDPOINT 1
https://siliconanalysts.com/api/mcp
Known tools 9
get_accelerator_costsReturns 13 specific AI accelerators (H100/H200/B100/B200/GB200, MI300X/MI355X, Gaudi 3, TPU v5p, Trainium 2, Maia 100, MTIA v2) with structured fields: chip, vendor, processNode, dieSizeMm2, memoryType, memoryCapacityGb, memoryBandwidthTbS, fp8TflopsSparse, bf16TflopsDense, packageType, estMfgCostUsd, estSellPriceUsd, chipGrossMarginPct, costBreakdown.{logicDie, hbm, packaging, testAssembly}, interconnect.
calculate_chip_costPure-function chip cost estimator.
get_hbm_market_dataReturns 9 HBM market sub-tables: accelerators, specs, marketShare, spotPrices, leadingIndicators, qualificationFeed, revenueForecast, supplierRevenue, validationChecks.
get_market_pulseReturns curated supply-chain headlines with trend direction (up/down/neutral), source attribution, and impact analysis.
get_wafer_pricingReturns 300mm wafer price ranges (min/avg/max USD), defect density, NRE/mask-set cost, and node maturity for: tsmc-n3, tsmc-n5, tsmc-n7, tsmc-28, samsung-3nm, samsung-5nm, intel-16.
get_packaging_costsReturns two sub-arrays: `packaging` (per-tech cost benchmark + capability matrix for CoWoS-S/L, EMIB, SoIC, InFO-PoP, FC-BGA, FC-CSP, etc.) and `hbmSpecs` (HBM2 through HBM4 cost per stack + bandwidth/capacity).
get_hbm_qualificationSourced HBM qualification tracker: which memory vendor (SK Hynix, Samsung, Micron) passed which AI-accelerator customer's qualification (NVIDIA Vera Rubin/GB300/B300/H200, AMD MI350/MI325X, Broadcom), by generation (HBM3/HBM3E/HBM4) and stack height.
get_foundry_allocationFoundry & advanced-packaging ALLOCATION — the current-state snapshot per node/tech (TSMC/Samsung/Intel/...
get_recent_changes"What Changed" — recent MOVEMENTS in Silicon Analysts' public data over a 7d/30d window, derived from the daily snapshot ledger.